Arm System-on-Modules
Use a defined compute module for processor, memory and boot functions while the carrier board implements application-specific I/O, power entry, protection and mechanics.
| Module category | Compute architecture | Form factor | Memory and storage | Primary interfaces |
|---|---|---|---|---|
| Low-power module | Single- or dual-core Cortex-A55 with Cortex-M class real-time core | OSM Size-S/SF or compact B2B | LPDDR4(X) · eMMC · QSPI | Dual GbE · USB · CAN · display |
| AI and vision module | Multi-core Arm processor with NPU or dedicated AI accelerator | OSM or SMARC | Scalable DDR/LPDDR · eMMC | MIPI camera · PCIe · Ethernet · display |
| High-performance module | Multi-core Cortex-A with GPU/NPU and real-time subsystem | SMARC, Qseven or proprietary B2B | LPDDR4/LPDDR5 · eMMC/UFS | PCIe · USB 3.x · multi-display · high-speed Ethernet |
Platform Capabilities
Concentrated compute integration
Processor, memory, boot storage, power sequencing and high-speed interfaces are implemented on the module rather than repeated on each carrier design.
Application-focused carrier design
The carrier can concentrate on field I/O, connectors, power entry, protection and enclosure requirements.
Defined processor choices
Compatible module families may offer different performance, graphics, AI and real-time options within the limits of the selected form factor and pinout.
Supported software baseline
Available BSPs, bootloaders and drivers provide a starting point for application development and maintenance, subject to the selected module and software release.
Technical Features
Prevalidated compute core
Processor, memory, boot storage, clocks and power sequencing are integrated and tested on the module.
Application-specific carrier
The carrier is optimised for field interfaces, connector placement, protection, input power and enclosure constraints.
Scalable processor choices
OSM, SMARC, SODIMM and Qseven portfolios span low-power control, graphics, AI and real-time processing needs.
High-speed interface breakout
PCIe, Ethernet, USB, display and camera interfaces are routed through standardised or high-density module connectors.
Software and security baseline
Linux BSPs, secure boot and processor security functions provide a defined software and update architecture.
Thermal and lifecycle planning
Heat spreaders, heat sinks and industrial-temperature options support long-life products when selected at project level.
Specifications
| Parameter | Unit | Value / Description |
|---|---|---|
| COMPUTE & MEMORY | ||
| Processor families | — | NXP, TI, Renesas, ST and MediaTek Arm application processors. |
| CPU architecture | — | Cortex-A application cores, frequently combined with Cortex-M/R real-time cores and optional GPU or NPU resources. |
| Module formats | — | OSM, SMARC, SODIMM, Qseven and proprietary high-density board-to-board modules. |
| System memory | — | DDR4, LPDDR4, LPDDR4X, LPDDR5 or LPDDR5X depending on processor and module. |
| Boot and storage | — | QSPI/OSPI flash, eMMC, EEPROM and optional UFS; removable or NVMe storage is normally implemented on the carrier. |
| INTERFACES & SOFTWARE | ||
| Networking | — | Gigabit Ethernet, TSN-capable Ethernet and higher-speed Ethernet on selected processors. |
| Expansion | — | PCIe, USB, SDIO, UART, SPI, I²C, CAN/CAN FD and GPIO, processor dependent. |
| Display and camera | — | MIPI DSI/CSI, LVDS, eDP, HDMI or DisplayPort, depending on the platform. |
| Wireless | — | Wi-Fi, Bluetooth and cellular interfaces may be integrated on the module or carrier. |
| Operating systems | — | Linux BSP support; Android and RTOS support are available on selected processor families. |
| Security | — | Secure boot and hardware security functions are processor dependent; discrete TPM support is carrier specific. |
| Form-factor compatibility | — | OSM, SMARC, SODIMM and Qseven are separate mechanical and electrical ecosystems; compatibility must be evaluated within the selected standard and module family. |
| DEPLOYMENT | ||
| Operating temperature | °C | Commercial, extended and industrial-temperature variants; exact limits are model specific. |
| Thermal solution | — | Heat spreader, heat sink or active cooling selected from processor power and ambient conditions. |
| Lifecycle | — | Product longevity, revision control and component availability should be confirmed for the selected module. |
Applications
Industrial HMI
Support display, touch and field-interface designs while selecting processor and graphics capability for the equipment variant.
Edge AI and vision
Add camera interfaces and local acceleration while keeping the high-speed compute subsystem on the module.
Medical devices
Provide a defined compute and software architecture for diagnostic, monitoring and imaging products.
Automotive electronics
Support telematics, gateway and cockpit platforms using processor families with real-time and networking capabilities.
Robotics
Combine real-time control, machine vision and industrial networking on an application-specific carrier.
Connected equipment
Use a common module strategy across related machines while adapting application I/O and enclosure design.