Single-Board Computers

Use one compact board that integrates compute, memory, storage, networking and common application I/O for system-level integration.

Best fit

Integrated standard I/O

Board format

Pico-ITX and compact SBCs

Integrated I/O

Ethernet · USB · display · camera

Software

Linux BSPs · selected Android/RTOS

Integrated compute Standard I/O Compact mechanics Supported BSP Industrial options System integration

Platform qualification: Platform qualification must confirm processor stepping, module pinout, carrier-board interface allocation, boot chain, BSP release, high-speed signal integrity, thermal solution, operating temperature and lifecycle before design freeze.

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Product category	Compute architecture	Integrated interfaces	Storage	Primary application
Low-power SBC	Single- or dual-core Cortex-A55; selected platforms add a real-time core	Dual GbE · USB · CAN · display	eMMC · microSD	Gateways and HMI
AI and vision SBC	Multi-core Arm processor with integrated NPU	MIPI camera · display · Ethernet · wireless	eMMC · optional M.2/NVMe	Vision and local inference
Automotive and real-time SBC	Application cores with Cortex-R/M real-time subsystem	CAN/CAN FD · TSN Ethernet · PCIe · camera	eMMC · microSD	Vehicle gateways and data systems

Platform Capabilities

Single-board computers are a practical choice when integrated standard I/O and a supported software baseline are more important than a highly customised carrier-board architecture.

Integrated board baseline

Processor, memory, storage, power regulation and common interfaces are delivered on one board for system-level integration.

Earlier software evaluation

A supported BSP and production-oriented board allow application software to be tested while enclosure and external I/O decisions are still being developed.

Fewer inter-board dependencies

Ethernet, wireless, display, camera, USB and field interfaces can be consolidated on one assembly where the selected board provides them.

Suitable for standard-I/O products

SBCs provide a straightforward path when the available connector set, thermal design and mechanics already match the application reasonably well.

Technical Features

The board combines the high-risk compute subsystem and common application interfaces. The system design can then focus on enclosure, power entry, external cabling, compliance and application software.

Integrated compute subsystem

Processor, memory, boot storage, clocks and power sequencing are implemented on the board as one validated baseline.

Application-ready interfaces

Ethernet, USB, display, camera, CAN and serial interfaces are exposed directly for common embedded use cases.

Deterministic networking options

Selected boards provide dual Ethernet and TSN-capable interfaces for time-aware communication and gateway functions.

Wireless connectivity

Wi-Fi, Bluetooth and IEEE 802.15.4 are available on selected platforms, reducing the need for separate radio integration.

Defined thermal path

Heat spreaders, heat sinks, fan sinks and enclosures can be selected around processor load and ambient conditions.

Board-support software

Bootloader, Linux BSP, device drivers and selected Android or RTOS support establish a controlled software starting point.

Specifications

Technical parameters vary by board family. Compare processor, memory, interfaces, form factor, environmental limits and software support against the system requirements.

Single-Board Computers technical specifications
Parameter	Unit	Value / Description
COMPUTE & MEMORY
Processor families	—	NXP, TI, Renesas, ST and MediaTek Arm application processors, depending on board family.
CPU architecture	—	Cortex-A application cores, often combined with Cortex-M/R real-time cores and optional GPU or NPU acceleration.
System memory	GB	DDR4, LPDDR4, LPDDR4X or LPDDR5 variants; capacity depends on the selected board.
Non-volatile storage	—	eMMC, QSPI/NOR flash and microSD; M.2 or NVMe support on selected platforms.
CONNECTIVITY & I/O
Ethernet	—	One or two Gigabit Ethernet ports; TSN support on selected processors and board designs.
Wireless	—	Wi-Fi, Bluetooth and optional IEEE 802.15.4 on selected boards.
USB	—	USB 2.0 and USB 3.x host or OTG interfaces, processor dependent.
Display and camera	—	HDMI, LVDS, eDP, MIPI DSI and MIPI CSI interfaces, model dependent.
Field interfaces	—	CAN/CAN FD, RS-232/422/485, UART, SPI, I²C and GPIO according to platform.
DEPLOYMENT
Mechanical format	mm	Pico-ITX is typically 100 × 72 mm; other compact formats are product specific.
Operating temperature	°C	Commercial, extended and industrial-temperature variants; confirm the exact range for the selected model.
Operating systems	—	Linux BSP support; Android and RTOS availability depends on the processor and board.
Lifecycle	—	Product longevity, revision control and component availability are model specific.

Applications

These platforms suit products where compact mechanics, integrated I/O and a supported software baseline are more valuable than a fully custom carrier-board architecture.

Industrial HMI

Combine graphics, touch, Ethernet and field interfaces on one compact compute board where the selected model provides the required I/O.

Edge AI

Process camera streams and run local inference close to the machine, supporting local decisions without sending every data point to the cloud.

Industrial gateways

Combine protocol conversion, Ethernet, wireless connectivity and secure remote access in one embedded platform.

Medical equipment

Provide connected compute for diagnostic, monitoring and imaging subsystems using a defined board and software baseline.

Automotive development

Support telematics, vehicle gateways, data logging and camera-processing prototypes with integrated networking and storage.

Embedded product development

Evaluate application software and system integration on production-oriented hardware during the development project.