FPGA and SoC-FPGA System-on-Modules
Use a module-based FPGA or SoC-FPGA architecture in which power, memory, configuration and selected transceiver routing are implemented on the module and application I/O remains on the carrier.
| Module category | Processing architecture | Transceiver capability | Memory architecture | Primary application |
|---|---|---|---|---|
| Cost-optimized FPGA module | FPGA or compact SoC-FPGA | Up to 12.5 Gb/s class on selected devices | LPDDR4/DDR4 · QSPI/eMMC | Control, vision and protocol processing |
| Mid-range SoC-FPGA module | Arm processing subsystem with FPGA fabric | Up to 28.1 or 58 Gb/s on selected devices | Separate processor and FPGA memory | Embedded control and acceleration |
| High-end adaptive-SoC module | Arm processors, programmable logic and AI/RF engines | Up to 32, 58 or 112 Gb/s depending on device and signalling mode | DDR4 or LPDDR5X · eMMC/UFS | AI, RF and high-speed networking |
Platform Capabilities
Integrated high-speed subsystem
DDR memory, boot devices, clocking, power sequencing and selected transceiver routes are implemented on the module.
Carrier focused on application I/O
The carrier can be designed around converters, connectors, field interfaces, power entry and mechanical constraints.
Scalable programmable-compute options
Module families may span FPGA, SoC-FPGA, RFSoC and adaptive-SoC devices, subject to connector, pinout, power and cooling compatibility.
Parallel hardware and software evaluation
Development platforms, FPGA toolchains and processor BSPs can support logic and application work while the final carrier is being defined.
Technical Features
Prevalidated power and memory
Power rails, DDR interfaces, boot devices, configuration circuitry and clocks are implemented and tested on the module.
Processor and logic partitioning
SoC-FPGA and adaptive-SoC devices combine software processing with deterministic programmable logic.
High-speed transceiver fabric
Selected modules expose transceivers for PCIe, Ethernet, Aurora, JESD204 and application-specific serial links.
Scalable silicon options
Portfolios span compact control devices through high-end AI, RF and networking platforms.
Security and update functions
Secure boot, encrypted configuration and remote-update capabilities depend on the selected silicon and system design.
Thermal integration
Heat spreaders, heat sinks and active cooling are selected from FPGA utilisation, power and ambient temperature.
Specifications
| Parameter | Unit | Value / Description |
|---|---|---|
| COMPUTE & MEMORY | ||
| Device classes | — | FPGA, SoC-FPGA, RFSoC and adaptive SoC modules across cost-optimized, mid-range and high-end families. |
| Logic and DSP resources | — | Device dependent, from compact control fabrics to multi-million-logic-cell acceleration platforms. |
| Processor subsystem | — | Optional Arm application and real-time processors in SoC-FPGA and adaptive-SoC devices. |
| System memory | — | DDR4, LPDDR4, LPDDR5 or LPDDR5X; separate processor and programmable-logic memory on selected modules. |
| Boot and storage | — | QSPI/OSPI flash, eMMC, EEPROM and optional UFS, depending on module. |
| HIGH-SPEED I/O & SOFTWARE | ||
| Serial transceivers | Gb/s | Approximately 12.5 to 112 Gb/s depending on FPGA family, transceiver type and NRZ/PAM4 signalling mode. |
| PCI Express | — | Selected module families implement PCIe Gen3, Gen4, Gen5 or Gen6-capable interfaces; supported generation and lane width are module specific. |
| Ethernet | — | Gigabit through multi-100-gigabit architectures, depending on MAC resources, transceivers and carrier design. |
| Converter interfaces | — | JESD204B/C, LVDS and direct-RF data converters on selected FPGA and RF platforms. |
| Software | — | Linux BSPs for processor subsystems, vendor FPGA toolchains, drivers and DMA reference designs. |
| DEPLOYMENT | ||
| Operating temperature | °C | Commercial, extended and industrial variants; exact limits depend on device, speed grade and module. |
| Compliance | — | RoHS and REACH status is product specific; CE documentation applies only where explicitly stated. |
| Thermal solution | — | Heat spreader, fan sink or application-specific cooling selected from worst-case power analysis. |
Applications
Data acquisition
Implement deterministic capture, triggering, timestamping and real-time preprocessing close to the sensor.
RF and SDR
Integrate JESD204 converters, channelisation and digital up/down conversion on a reusable compute module.
Machine vision
Aggregate multiple cameras and perform low-latency image pipelines before data reaches the host processor.
Industrial networking
Offload time-sensitive packet processing, protocol handling and deterministic control into programmable logic.
Aerospace and defence
Build radar, electronic-warfare, sensor-fusion and mission-computing payloads around scalable FPGA resources.
Compute acceleration
Move signal processing, inference and network workloads onto PCIe-connected programmable hardware.